RF-10 2-Layer 0.6mm PCB – 20mil Ceramic-Filled PTFE with Immersion Silver for High-Frequency RF Applications
1.Introduction to RF-10 2-Layer 0.6mm PCB
RF-10 copper clad laminates are composites of ceramic-filled PTFE and woven fiberglass, offering the advantage of high dielectric constant and low dissipation factor. The thin woven fiberglass reinforcement provides both low dielectric loss and improved rigidity for ease of handling, while enhancing dimensional stability for multilayer circuits. These laminates are engineered to deliver a cost-effective substrate with industry-acceptable delivery times, addressing the need for size reduction in RF applications. RF-10 bonds effectively with smooth low-profile copper, and its low dissipation factor combined with very smooth copper results in optimal insertion losses at higher frequencies where skin effect losses play a substantial role.
2.Key Features
Dielectric Constant: 10.2 ± 0.3 at 10GHz
Dissipation Factor: 0.0025 at 10GHz
High Thermal Conductivity: 0.85 W/m·K (Unclad)
CTE: x-axis 16 ppm/°C, y-axis 20 ppm/°C, z-axis 25 ppm/°C
Low Moisture Absorption: 0.08%
Flammability Rating: UL 94 V-0
3.Benefits
High DK enables RF circuit size reduction
Excellent dimensional stability
Tight DK tolerance (10.2 ± 0.3)
Enhanced thermal management through high thermal conductivity
Excellent adhesion to smooth copper surfaces
Low CTE in X, Y, and Z directions
Outstanding price/performance ratio
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RF-10 |
| Layer Count | 2-layer |
| Board Dimensions | 130mm × 60mm (±0.15mm) |
| Min. Trace/Space | 5 mil / 7 mil |
| Min. Hole Size | 0.3 mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6 mm |
| Finished Cu Weight | 1 oz |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35μm (1oz)
RF-10 Core - 20mil (0.508mm)
Copper_layer_2 - 35μm (1oz
6.PCB Statistics:
Components: 19
Total Pads: 44
Thru Hole Pads: 32
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 27
Nets: 2
7.Typical Applications
Microstrip patch antennas
GPS antennas
Passive components (filters, couplers, power dividers)
Aircraft collision avoidance systems
Satellite components
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
